Main description:

This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.

Feature:

Describes a variety of problems confronting any designer of implantable microelectronic devices for the brain

Avoids discipline-specific, technical jargon in order to appeal to a multi-disciplinary audience

Includes a focused exploration of the brain-material interface problem, as well as the surgical and skull-mounting issues that impact the choice and success of packaging and interconnect technologies

Back cover:

This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.

Contents:

Introduction.- Interconnect technologies.- Encapsulation technologies.- Testing and validation.- Emerging technologies and packaging challenges.